[1] Reichl H, Aschenbrenner R, Töpper M et al (2009). Heterogeneous integration: building the foundation for innovative products. More than Moore: creating high value micro/nanoelectronics systems, 279-303
[2] Shalf J (2020) The future of computing beyond Moore’s Law. Phil Trans R Soc A 378(2166):20190061
[3] Hisamoto D, Lee WC, Kedzierski J et al (2000) FinFET-a self-aligned double-gate MOSFET scalable to 20 nm. IEEE Trans Electron Devices 47(12):2320-2325
[4] Chen W, Hu G, Lin J et al (2015) High-performance, single-pyramid micro light-emitting diode with leakage current confinement layer. Appl Phys Express 8(3):032102
[5] Zohmingliana, Choudhuri B, Bhowmick B (2022) Study the impact of graphene channel over conventional silicon on DC/analog and RF performance of DG dual-material-gate VTFET. Microelectron J 128:105581
[6] Luo J, Xu WK, Fu BY et al (2021) Energy and area-efficient Fe-FinFET-based time-domain mixed-signal computing in memory for edge machine learning. In: 2021 IEEE International Electron Devices Meeting (IEDM). IEEE, San Francisco, pp 19.5.1-19.5.4
[7] Yu D(2020) Innovation heterogeneous integration technologies-the new path going forward. IEEE Electronic Components and Technology Conference. San Diego pp 380-385
[8] Chen MF, Chen FC, Chiou WC et al (2019) System on integrated chips (SoIC(TM) for 3D heterogeneous integration. 2019 IEEE 69TH Electronic Components and Technology Conference (ECTC). IEEE, Las Vegas, pp 594-599
[9] Wong HSP (2022) 3D MOSAIC of N3XT Chips: Domain-Specific Technology for Future Systems, plenary paper, IEEE World Forum on the Internet of Things, November 7
[10] Mahajan R (2019) Advanced packaging architectures for heterogeneous integration. In: 2019 IEEE PELS/PSMA Phoenix Workshop on Packaging and Inte-gration in Power Delivery (PwrPack)
[11] Long HH, Zhang L, Ma HC et al (2022) Heterogeneous integration system in display for next generation terminal device. IEEE Trans Compon Packag Manuf Technol 12(5):731-739
[12] Long HH, Ma HC, Gao JY et al (2023) Manufacturability and mechanical reliability study for heterogeneous integration system in display (HiSID). Adv Manuf 11:191-202
[13] Zhang GQ, Van Roosmalen F, Graef M (2005) The paradigm of “more than Moore”. In: 2005 6th International Conference on Electronic Packaging Technology. IEEE, Shenzhen, pp 17-24
[14] Lee TK, Bieler TR, Kim C et al (2015) Fundamentals of lead-free solder interconnect technology. Springer (US) Chapter 1:1-20
[15] Kwon SG, Kang J, Back S et al (2020) Rapid electronic interconnection across the glass boundary edge for sustainable and lean electronics manufacturing. ACS Sustain Chem Eng 8(30):11348-11357
[16] Huang SX, Long HH, Li JH et al (2022) An effective analytical method for the interface reliability design of System-in-Package in thermal environments. In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). IEEE, Dalian, pp 1-6
[17] Huang SX, Long HH, Li JH et al (2022) The mechanical reliability design of thin-film encapsulation for laminated-based flexible organic light emitting diodes using semi-analytical method. In: 2022 IEEE International Flexible Electronics Technology Conference (IFETC). IEEE, Qingdao, pp 1-6
[18] Huang SX, Long HH, Li JH et al (2023) Interfacial reliability analysis and structural optimization of System-in-Package module. In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT). IEEE, Xinjiang, pp 1-6
[19] Virey E, Bouhamri Z (2021) MicroLED displays-market, industry and technology trends 2021. In: Yole Developpement. https://www.yole.fr/
[20] Virey EH, Baron N (2018) 45‐1: status and prospects of micro-LED displays. In: SID symposium digest of technical papers, 49(1). pp 593-596
[21] Yeo KS, Ng WX, Soh MY et al (2017) Micro-LED arrays for display and communication: device structure and driver architecture. In: 2017 IEEE 12th international conference on ASIC (ASICON). IEEE, Guiyang, pp 993-996
[22] Olivier F, Daami A, Dupré L et al (2017) 25-4: investigation and improvement of 10μm pixel-pitch GaN-based micro-LED arrays with very high brightness. SID Symp Dig Tech Pap 48(1):353-356
[23] Long HH, Cao X, Ye RQ et al (2023) Display module and electronic device. US Patent App. 18/007, 259
[24] Liang X, Liu Z, Xia Y, et al (2022) Lifting triplet energy and bipolar characteristics by limiting the rotation of the peripheral groups in host materials to achieve high-efficiency blue OLED. Chemistry-An Asian Journal, 17(3): e202101298
[25] Kim MK, Kim DW, Moon SH et al (2017) One step process of decomposition and polymerization to fabricate SiO hollow spheres/polyimide composite for foldable OLEDs. Materials Science and Engineering: B, 217:7-11
[26] Ma HC, Long HH, Zhang L et al (2022) Signal integrity with ultra-low latency in heterogeneous integration system in display (HiSID). In: 2022 13th Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC). IEEE, Beijing, pp 620-623
[27] Kim Y, Cho J, Kim JJ et al (2016) Measurement and analysis of glass interposer power distribution network resonance effects on a high-speed through glass via channel. IEEE Trans Electromagn Compat 58(6):1747-1759
[28] Olivier F, Tirano S, Dupré L et al (2017) Influence of size-reduction on the performances of GaN-based micro-LEDs for display application. J Lumin 191:112-116
[29] Meyaard DS, Lin GB, Cho J et al (2014) Efficiency droop in gallium indium nitride (GaInN)/gallium nitride (GaN) LEDs. In: Nitride semiconductor light-emitting diodes (LEDs). Woodhead Publishing, Troy, pp 279-300
[30] Ryu HY, Kim HS, Shim JI (2009) Rate equation analysis of efficiency droop in InGaN light-emitting diodes. Appl Phys Lett 95(8):081114
[31] Zhang L, Ou F, Chong WC et al (2018) Wafer-scale monolithic hybrid integration of Si-based IC and III-V epi-layers—a mass manufacturable approach for active matrix micro-LED micro-displays. J Soc Inform Display 26(3):137-145
[32] Huang SX, Long HH, Li JH (2022) An effective analytical method for thermal stresses analysis of heterogeneous integration system in display. In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). IEEE, Singapore, pp 616-621
[33] Huang SX, Long HH, Li JH et al (2023) The structural optimization of heterogeneous integration system in display based on thermal reliability analysis. In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT). IEEE, Xinjiang pp 1-6
[34] Huang SX, Zhou ZQ, Gao JY et al (2023) Artificial intelligence aided design for heterogeneous integration system in display. In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). IEEE, Singapore pp 818-823
[35] Jordan MI, Mitchell TM (2015) Machine learning: trends, perspectives, and prospects. Science 349(6245):255-260
[36] Wuest T, Weimer D, Irgens C et al (2016) Machine learning in manufacturing: advantages, challenges, and applications. Prod Manuf Res 4(1):23-45
[37] Chen ZW, Zhang Z, Dong F et al (2021) A hybrid finite element modeling: artificial neural network approach for predicting solder joint fatigue life in wafer-level chip scale packages. J Electron Packag 143(1):011001
[38] Selvanayagam C, Mandal R, Duong PLT, et al (2019) Neural network assisted speed up of high-fidelity warpage simulations towards design for reliability in ultra-thin packages. In: 2019 IEEE CPMT Symposium Japan (ICSJ) IEEE, Janpan, pp 89-93
[39] Meszmer P, Majd M, Prisacaru A et al (2021) Neural networks for enhanced stress prognostics for encapsulated electronic packages-a comparison. Microelectron Reliabil 123:114181 |
