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Stability of p-GaN gate AlGaN/GaN HEMTs under static and dynamic drain stress
Linfei Gao, Xiaohua Li, Wei He, Xinbo Xiong, Huaibao Yan, Hsien-Chin Chiu, Zhanwu Yang, Lixuan Chen, Qiubao Lin, Kaifeng Wang, Hezhou Liu, Xinke Liu
Moore and More
2025, 1 (3):
290-299.
DOI: 10.1007/s44275-025-00029-0
In this article, we report the investigation into the stability of p-GaN gate high electron mobility transistors (HEMTs) with an internal integrated gate circuit that led to the design of a capacitance-based circuit to address threshold voltage shifts (ΔVTH). Pulse I-V measurement revealed a notable positive gate VTH shift of 0.7 V as the drain voltage increased from 0 to 650 V, highlighting the impact of drain bias on VTH instability. Through the investigation of drain bias-induced VTH instability and the behavior of carriers being transported within the gate region, it was found that the maximum ΔVTH is 0.4 V when a 200-V drain bias is applied; after stress removal, ΔVTH diminishes gradually due to the discharge of capacitance, and holes enter the p-GaN layer to mitigate the depletion of holes. The integration of passive components and p-GaN gate HEMT circuits is suggested to address VTH instability in enhancement-mode HEMT devices. The reliability of power devices is essential for their acceptance in emerging applications.
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