Ferroelectric behavior of E-beam evaporated Hf0.5Zr0.5O2 thin film and integration with GaN HEMTs toward programmable current switching
Received date: 2025-09-14
Revised date: 2025-10-16
Accepted date: 2025-10-27
Online published: 2026-05-12
This letter demonstrates an AlGaN/GaN high-electron-mobility transistors (HEMTs) incorporating a Hf 0.5Zr 0.5O 2 (HZO)/Al 2O 3 ferroelectric gate dielectric fabricated via electron-beam evaporation (E-beam) technique. Through precise control of HZO growth processes and post-annealing treatments, high-quality ferroelectric thin films were obtained, acting as the gate dielectric, enabling an ultra-high current on/off ratio of 10 8, a low subthreshold slope (SS) of 64.4 mV/dec, and a wide tuning range of the threshold voltage (V TH). Our work indicates that ferroelectric polarization significantly influences electron transport behavior at the AlGaN/GaN interface, highlighting the potential of E-beam evaporated HZO thin film used in the application of next-generation power electronic systems.
Fang Ye , Huaxin Shen , Sitong Chen , Tian Luo , Fanping Meng , Jie Lin , Li Chen , Zixian Jiang , Xiaohang Li , Jichun Ye , Wei Guo . Ferroelectric behavior of E-beam evaporated Hf0.5Zr0.5O2 thin film and integration with GaN HEMTs toward programmable current switching[J]. Moore and More, 2026 , 2(1) : 37 -45 . DOI: 10.1007/s44275-025-00039-y
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